New Dansensor^® Lippke Model 5000 Package Test System – Package Integrity, Seal Strength & Leak Detection Laboratory Instrument.

Test Method Capabilities :

• Burst Test as per ASTM F 2095 & ASTM F 2054
• Leak-Pressure Decay Test as per ASTM F 2096
• Multi-Test
• Water Bubble Test as per ASTM F 2096, ASTM D 3078
• Creep Test as per ASTM F 1140

The 5 additional test modes are :

• Creep Test
• Creep to Fail
• Creep and Leak Test
• Creep and Burst Test
• Creep, Leak and Burst Test

The Lippke® Model 5000 package test system is a stand alone, bench top instrument designed to perform virtually all currently accepted test methods used to measure the seal strength, leak detection and package integrity of :

• Flexible Pouches,
• Rigid Bottles,
• Porous Packages,
• Ttyvek material,
• Laminate Packages (3 side seal & 1 side open),
• Foil type consumer and medical packaging,
• Tin Containers